Diagram Showing The Production Of Circuit Boards IELTS Writing Task 1 has an illustration of the process of how circuit boards are produced. This IELTS section is mainly based on the various types of flowcharts, pie charts, diagrams and graphs. The candidates in order to attempt this section should mandatorily understand the image and then should put forward their answer. In IELTS Writing Task 1 topic named Diagram Showing The Production Of Circuit Boards IELTS Writing Task 1, three model answers with different perspectives have been mentioned. This IELTS writing topic; Diagram Showing The Production Of Circuit Boards IELTS Writing Task 1 comprises a critical evaluation. Candidates must write a total of 150 words in the IELTS writing task 1. IELTS Academic Writing Task 1 requires candidates to produce a summary within the allotted time of 20 minutes. Based on the band scores, IELTS writing score is evaluated. The band scores basically range in between 0 and 9. The candidates can undertake IELTS writing practice papers as their concern which will help them to flourish their writing abilities.

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Topic : The diagram shows the production of circuit boards. Summarise the information by selecting and reporting the main features, and make comparisons where relevant.

Band 8 IELTS

A process for producing circuit boards is shown in stages in the flowchart. Producing a circuit board, testing the product, and packaging it for delivery are the three main stages of the process overall.

The first step is the delivery of the raw materials for creating the circuit board. The materials are then cut, doused with a fire retardant, and cleaned. This leads to the subsequent step, which is soldering the IC to the board and attaching it. Following that, a visual inspection is performed as part of the final testing process, along with quality control testing. This procedure eliminates any circuit boards that do not meet the required standards, ensuring that only the best circuit boards are delivered. Chips are then removed and discarded from boards that do not meet the quality standards.

Finally, the circuit board is packaged appropriately after passing the last round of testing. After this, the circuit boards are sent to factories which completes the process.

Band 7 IELTS

The creation of IC-operated circuit boards can be summarized in the following manner according to the diagram.

In general, there are three stages, with the initial treatment of the plain boards coming first. The next step is IC application, which contains a feedback loop in case of flaws and ultimately results in some operational testing, aesthetic adjustments, and a finished product that is prepared for integration into electronic goods. The first stage also involves the delivery of the base material in bulk for cutting to the proper size, fireproofing, and then cleaning the units of debris.

Moving on to the next step, soldering and intricate IC attachment are handled by machines. Although the subsequent inspection and checks still require human assistance. With an undefined mechanism, the compromised boards are stripped, and the chips are then thrown away. This is presumably more economical than fault finding and repair. Then an IC- attachment return occurs, starting a cycle that could theoretically go on forever until a fault-free product is produced.

Numerous tests regarding the last section attest to functionality. In the absence of these, the boards are placed back into the central cycle, providing a rigorous dual assurance of quality. Only properly closed products are then appropriately packaged for shipment to factories. The process ends here.

Band 7.5 IELTS

The diagram has a flow chart of the production of circuit boards. Beginning with delivery material, there are nine stages in total in the production of a circuit board. The final two steps, as well as the first three steps, are not repeated.

Getting the materials to the lab is the first step in making circuit boards. After that, it needs to be cut and fire retardant sprayed on it. Circuit board cleaning is the third step. Automated soldering and IC attachment make up the fourth stage. Visual inspection and quality control testing make up the fifth step. There are two options that come out of visual inspection and quality control testing. Chips will be discarded if inspection and quality control reject them. If inspection and quality control have given their approval, they will be sent to final testing

If the final testing yields positive results, they will go for packaging and delivery to factories. For negative results, the automated IC attachment and soldering steps take place again. Up until the conclusion of the testing, the cycle will be repeated. The process ends when the final testing is approved and the circuit boards are sent for delivery.

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